3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.

Market Analysis and Insights: Global 3D ICs Market
The global 3D ICs market size is projected to reach US$ XX million by 2027, from US$ XX million in 2020, at a CAGR of XX% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global 3D ICs market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global 3D ICs market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global 3D ICs market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global 3D ICs market.

Global 3D ICs Scope and Market Size
3D ICs market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global 3D ICs market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
3D SiCs
Monolithic 3D ICs

Segment by Application
Automotive
Smart Technologies
Robotics
Electronics
Medical
Industrial

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
Xilinx
Advanced Semiconductor Engineering (ASE)
Samsung
STMicroelectronics
Taiwan Semiconductors Manufacturing (TSMC)
Toshiba
EV Group
Tessera