Adhesive for Electronics Market - Global Outlook and Forecast 2024-2031

Report ID: 1365658 | Published Date: Oct 2024 | No. of Page: 114 | Base Year: 2023 | Rating: 4.9 | Webstory: Check our Web story

It is an adhesive used in electronic packaging.
This report contains market size and forecasts of Adhesive for Electronics in global, including the following market information:
Global Adhesive for Electronics Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Adhesive for Electronics Market Sales, 2017-2022, 2023-2028, (Kiloton)
Global top five Adhesive for Electronics companies in 2021 (%)
The global Adhesive for Electronics market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Non-Electrically Conductive Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Adhesive for Electronics include Henkel, Permabond, H.B.Fuller, Bostik, 3M, Master Bond, Protavic, Heartland Adhesives and Panacol, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Adhesive for Electronics manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Adhesive for Electronics Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Adhesive for Electronics Market Segment Percentages, by Type, 2021 (%)
Non-Electrically Conductive
Electrically Conductive
Global Adhesive for Electronics Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Adhesive for Electronics Market Segment Percentages, by Application, 2021 (%)
Surface Mounting
Conformal Coatings
Potting and Encapsulation
Other
Global Adhesive for Electronics Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Adhesive for Electronics Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Adhesive for Electronics revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Adhesive for Electronics revenues share in global market, 2021 (%)
Key companies Adhesive for Electronics sales in global market, 2017-2022 (Estimated), (Kiloton)
Key companies Adhesive for Electronics sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Henkel
Permabond
H.B.Fuller
Bostik
3M
Master Bond
Protavic
Heartland Adhesives
Panacol
LORD Corporation
Heraeus
Kohesi Bond
Tex Year Group
Hexion
Jowat
Mactac

Frequently Asked Questions
Adhesive for Electronics Market report offers great insights of the market and consumer data and their interpretation through various figures and graphs. Report has embedded global market and regional market deep analysis through various research methodologies. The report also offers great competitor analysis of the industries and highlights the key aspect of their business like success stories, market development and growth rate.
Adhesive for Electronics Market report is categorised based on following features:
  1. Global Market Players
  2. Geopolitical regions
  3. Consumer Insights
  4. Technological advancement
  5. Historic and Future Analysis of the Market
Adhesive for Electronics Market report is designed on the six basic aspects of analysing the market, which covers the SWOT and SWAR analysis like strength, weakness, opportunity, threat, aspirations and results. This methodology helps investors to reach on to the desired and correct decision to put their capital into the market.

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