Fine pitch leadframes allow for smaller packages by reducing the gap between the tips of the inner leads. A leadframe with this ultra-fine pitch brings the lead tips closer together than conventional leadframes, reducing gold wire consumption and improving wafer efficiency by shrinking semiconductor chip size; thereby improving overall price/performance.
Market Analysis and Insights: Global and United States Fine Pitch Leadframe Market
This report focuses on global and United States Fine Pitch Leadframe market, also covers the segmentation data of other regions in regional level and county level.
Due to the COVID-19 pandemic, the global Fine Pitch Leadframe market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, by Type, Stamping Process Leadframe accounting for % of the Fine Pitch Leadframe global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While by Application, Integrated Circuit was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
In United States the Fine Pitch Leadframe market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period.
Global Fine Pitch Leadframe Scope and Market Size
Fine Pitch Leadframe market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Fine Pitch Leadframe market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the Fine Pitch Leadframe market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type
Stamping Process Leadframe
Etching process Leadframe
Segment by Application
Integrated Circuit
Discrete Device
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
By Company
Mitsui High-tec
Toppan
Shinko
HAESUNG DS
ASE Electronics
Possehl Electronics
Dynacraft Industries
DSK Technologies
Batten and Allen
Unisem Group
Chang Wah Technology
QPL Limited
Shenzhen Xinhaisen Technology
Phoenix Pioneer Technology