FC-BGA substrates are high-density semiconductor packaging substrates that enable high speed and multi-functionality of LSI chips. The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board, and protects expensive semiconductors from external stress. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.

Market Analysis and Insights: Global Flip Chip Ball Grid Array (FCBGA) Market
The global Flip Chip Ball Grid Array (FCBGA) market was valued at US$ million in 2020 and it is expected to reach US$ million by the end of 2027, growing at a CAGR of % during 2021-2027.

Global Flip Chip Ball Grid Array (FCBGA) Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Flip Chip Ball Grid Array (FCBGA) Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Segment by Type
Below 8 Layer
8-20 Layer
Others

Segment by Application
CPU
ASIC
GPU
Others

By Company
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
AT＆S
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China

Production by Region
North America
Europe
China
Japan
South Korea

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE