The global Form in Place (FIP) Gaskets market was valued at 222.8 Million USD in 2021 and will grow with a CAGR of 5.02% from 2021 to 2027, based on HNY Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Form-in-Place gaskets (FIPG) are designed to replace conventional gaskets & O-rings, and involve dispensing conductive or non-conductive elastomers directly onto metal or plastic substrates. Conductive materials are typically applied to electronic components or devices for EMI & RFI shielding, and non-conductive materials are used for environmental sealing or bonding. Formed-in-place gaskets (FIPG) have been in use for a few decades in the automotive industry. Many applications are in the power train system - engine & driveline. This would include engine block to oil pan, engine cover to engine block, intake manifolds, thermostat housings, pump covers, power steering housings, etc. Additional applications are in components, particularly electrical components and lamps, such as headlamps, side markers, etc. According to types, the most proportion of the Form in Place (FIP) Gaskets is Conductive Form-In-Place Gaskets, taking about 62% sales share of global market in 2020. The most proportion of Form in Place (FIP) Gaskets is used for Electronics and the proportion is about 57% in 2020. Europe and North America is the major consumption region of the global market, which take about 66% market share.

By Market Verdors:

Parker Chomerics

Nolato

Laird

Henkel

Rampf Group

Dymax Corporation

3M

CHT UK Bridgwater

Nystein

Permabond

Dow

KÖPP

Wacker Chemie

DAFA Polska

MAJR Products

EMI-tec

ThreeBond Group

Hangzhou Zhijiang

DELO

By Types:

Conductive Form-In-Place Gaskets

Non-Conductive Form-In-Place Gaskets

By Applications:

Automotive

Electronics

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

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