Global Wafer Bump Packaging Market Research Report 2024

Report ID: 1861378 | Published Date: Oct 2024 | No. of Page: 92 | Base Year: 2023 | Rating: 4.7 | Webstory: Check our Web story
Request Sample Report
Pre-Order Enquiry
Request Discount(%) 
1 Report Overview
    1.1 Study Scope
    1.2 Market Analysis by Type
        1.2.1 Global Wafer Bump Packaging Market Size Growth Rate by Type: 2017 VS 2021 VS 2028
        1.2.2 Gold Bumping
        1.2.3 Solder Bumping
        1.2.4 Copper Pillar Alloy
        1.2.5 Other
    1.3 Market by Application
        1.3.1 Global Wafer Bump Packaging Market Share by Application: 2017 VS 2021 VS 2028
        1.3.2 Smartphone
        1.3.3 LCD TV
        1.3.4 Notebook
        1.3.5 Tablet
        1.3.6 Monitor
        1.3.7 Other
    1.4 Study Objectives
    1.5 Years Considered
2 Global Growth Trends
    2.1 Global Wafer Bump Packaging Market Perspective (2017-2028)
    2.2 Wafer Bump Packaging Growth Trends by Region
        2.2.1 Wafer Bump Packaging Market Size by Region: 2017 VS 2021 VS 2028
        2.2.2 Wafer Bump Packaging Historic Market Size by Region (2017-2022)
        2.2.3 Wafer Bump Packaging Forecasted Market Size by Region (2023-2028)
    2.3 Wafer Bump Packaging Market Dynamics
        2.3.1 Wafer Bump Packaging Industry Trends
        2.3.2 Wafer Bump Packaging Market Drivers
        2.3.3 Wafer Bump Packaging Market Challenges
        2.3.4 Wafer Bump Packaging Market Restraints
3 Competition Landscape by Key Players
    3.1 Global Top Wafer Bump Packaging Players by Revenue
        3.1.1 Global Top Wafer Bump Packaging Players by Revenue (2017-2022)
        3.1.2 Global Wafer Bump Packaging Revenue Market Share by Players (2017-2022)
    3.2 Global Wafer Bump Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
    3.3 Players Covered: Ranking by Wafer Bump Packaging Revenue
    3.4 Global Wafer Bump Packaging Market Concentration Ratio
        3.4.1 Global Wafer Bump Packaging Market Concentration Ratio (CR5 and HHI)
        3.4.2 Global Top 10 and Top 5 Companies by Wafer Bump Packaging Revenue in 2021
    3.5 Wafer Bump Packaging Key Players Head office and Area Served
    3.6 Key Players Wafer Bump Packaging Product Solution and Service
    3.7 Date of Enter into Wafer Bump Packaging Market
    3.8 Mergers & Acquisitions, Expansion Plans
4 Wafer Bump Packaging Breakdown Data by Type
    4.1 Global Wafer Bump Packaging Historic Market Size by Type (2017-2022)
    4.2 Global Wafer Bump Packaging Forecasted Market Size by Type (2023-2028)
5 Wafer Bump Packaging Breakdown Data by Application
    5.1 Global Wafer Bump Packaging Historic Market Size by Application (2017-2022)
    5.2 Global Wafer Bump Packaging Forecasted Market Size by Application (2023-2028)
6 North America
    6.1 North America Wafer Bump Packaging Market Size (2017-2028)
    6.2 North America Wafer Bump Packaging Market Size by Country (2017-2022)
    6.3 North America Wafer Bump Packaging Market Size by Country (2023-2028)
    6.4 United States
    6.5 Canada
7 Europe
    7.1 Europe Wafer Bump Packaging Market Size (2017-2028)
    7.2 Europe Wafer Bump Packaging Market Size by Country (2017-2022)
    7.3 Europe Wafer Bump Packaging Market Size by Country (2023-2028)
    7.4 Germany
    7.5 France
    7.6 U.K.
    7.7 Italy
    7.8 Russia
    7.9 Nordic Countries
8 Asia-Pacific
    8.1 Asia-Pacific Wafer Bump Packaging Market Size (2017-2028)
    8.2 Asia-Pacific Wafer Bump Packaging Market Size by Country (2017-2022)
    8.3 Asia-Pacific Wafer Bump Packaging Market Size by Country (2023-2028)
    8.4 China
    8.5 Japan
    8.6 South Korea
    8.7 Southeast Asia
    8.8 India
    8.9 Australia
9 Latin America
    9.1 Latin America Wafer Bump Packaging Market Size (2017-2028)
    9.2 Latin America Wafer Bump Packaging Market Size by Country (2017-2022)
    9.3 Latin America Wafer Bump Packaging Market Size by Country (2023-2028)
    9.4 Mexico
    9.5 Brazil
10 Middle East & Africa
    10.1 Middle East & Africa Wafer Bump Packaging Market Size (2017-2028)
    10.2 Middle East & Africa Wafer Bump Packaging Market Size by Country (2017-2022)
    10.3 Middle East & Africa Wafer Bump Packaging Market Size by Country (2023-2028)
    10.4 Turkey
    10.5 Saudi Arabia
    10.6 UAE
11 Key Players Profiles
    11.1 ASE Technology
        11.1.1 ASE Technology Company Detail
        11.1.2 ASE Technology Business Overview
        11.1.3 ASE Technology Wafer Bump Packaging Introduction
        11.1.4 ASE Technology Revenue in Wafer Bump Packaging Business (2017-2022)
        11.1.5 ASE Technology Recent Development
    11.2 Amkor Technology
        11.2.1 Amkor Technology Company Detail
        11.2.2 Amkor Technology Business Overview
        11.2.3 Amkor Technology Wafer Bump Packaging Introduction
        11.2.4 Amkor Technology Revenue in Wafer Bump Packaging Business (2017-2022)
        11.2.5 Amkor Technology Recent Development
    11.3 JCET Group
        11.3.1 JCET Group Company Detail
        11.3.2 JCET Group Business Overview
        11.3.3 JCET Group Wafer Bump Packaging Introduction
        11.3.4 JCET Group Revenue in Wafer Bump Packaging Business (2017-2022)
        11.3.5 JCET Group Recent Development
    11.4 Powertech Technology
        11.4.1 Powertech Technology Company Detail
        11.4.2 Powertech Technology Business Overview
        11.4.3 Powertech Technology Wafer Bump Packaging Introduction
        11.4.4 Powertech Technology Revenue in Wafer Bump Packaging Business (2017-2022)
        11.4.5 Powertech Technology Recent Development
    11.5 TongFu Microelectronics
        11.5.1 TongFu Microelectronics Company Detail
        11.5.2 TongFu Microelectronics Business Overview
        11.5.3 TongFu Microelectronics Wafer Bump Packaging Introduction
        11.5.4 TongFu Microelectronics Revenue in Wafer Bump Packaging Business (2017-2022)
        11.5.5 TongFu Microelectronics Recent Development
    11.6 Tianshui Huatian Technology
        11.6.1 Tianshui Huatian Technology Company Detail
        11.6.2 Tianshui Huatian Technology Business Overview
        11.6.3 Tianshui Huatian Technology Wafer Bump Packaging Introduction
        11.6.4 Tianshui Huatian Technology Revenue in Wafer Bump Packaging Business (2017-2022)
        11.6.5 Tianshui Huatian Technology Recent Development
    11.7 Chipbond Technology
        11.7.1 Chipbond Technology Company Detail
        11.7.2 Chipbond Technology Business Overview
        11.7.3 Chipbond Technology Wafer Bump Packaging Introduction
        11.7.4 Chipbond Technology Revenue in Wafer Bump Packaging Business (2017-2022)
        11.7.5 Chipbond Technology Recent Development
    11.8 ChipMOS
        11.8.1 ChipMOS Company Detail
        11.8.2 ChipMOS Business Overview
        11.8.3 ChipMOS Wafer Bump Packaging Introduction
        11.8.4 ChipMOS Revenue in Wafer Bump Packaging Business (2017-2022)
        11.8.5 ChipMOS Recent Development
    11.9 Hefei Chipmore Technology
        11.9.1 Hefei Chipmore Technology Company Detail
        11.9.2 Hefei Chipmore Technology Business Overview
        11.9.3 Hefei Chipmore Technology Wafer Bump Packaging Introduction
        11.9.4 Hefei Chipmore Technology Revenue in Wafer Bump Packaging Business (2017-2022)
        11.9.5 Hefei Chipmore Technology Recent Development
    11.10 Union Semiconductor (Hefei)
        11.10.1 Union Semiconductor (Hefei) Company Detail
        11.10.2 Union Semiconductor (Hefei) Business Overview
        11.10.3 Union Semiconductor (Hefei) Wafer Bump Packaging Introduction
        11.10.4 Union Semiconductor (Hefei) Revenue in Wafer Bump Packaging Business (2017-2022)
        11.10.5 Union Semiconductor (Hefei) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
    13.1 Research Methodology
        13.1.1 Methodology/Research Approach
        13.1.2 Data Source
    13.2 Disclaimer
    13.3 Author Details

List of Tables
    Table 1. Global Wafer Bump Packaging Market Size Growth Rate by Type (US$ Million): 2017 VS 2021 VS 2028
    Table 2. Key Players of Gold Bumping
    Table 3. Key Players of Solder Bumping
    Table 4. Key Players of Copper Pillar Alloy
    Table 5. Key Players of Other
    Table 6. Global Wafer Bump Packaging Market Size Growth by Application (US$ Million): 2017 VS 2021 VS 2028
    Table 7. Global Wafer Bump Packaging Market Size by Region (US$ Million): 2017 VS 2021 VS 2028
    Table 8. Global Wafer Bump Packaging Market Size by Region (2017-2022) & (US$ Million)
    Table 9. Global Wafer Bump Packaging Market Share by Region (2017-2022)
    Table 10. Global Wafer Bump Packaging Forecasted Market Size by Region (2023-2028) & (US$ Million)
    Table 11. Global Wafer Bump Packaging Market Share by Region (2023-2028)
    Table 12. Wafer Bump Packaging Market Trends
    Table 13. Wafer Bump Packaging Market Drivers
    Table 14. Wafer Bump Packaging Market Challenges
    Table 15. Wafer Bump Packaging Market Restraints
    Table 16. Global Wafer Bump Packaging Revenue by Players (2017-2022) & (US$ Million)
    Table 17. Global Wafer Bump Packaging Market Share by Players (2017-2022)
    Table 18. Global Top Wafer Bump Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bump Packaging as of 2021)
    Table 19. Ranking of Global Top Wafer Bump Packaging Companies by Revenue (US$ Million) in 2021
    Table 20. Global 5 Largest Players Market Share by Wafer Bump Packaging Revenue (CR5 and HHI) & (2017-2022)
    Table 21. Key Players Headquarters and Area Served
    Table 22. Key Players Wafer Bump Packaging Product Solution and Service
    Table 23. Date of Enter into Wafer Bump Packaging Market
    Table 24. Mergers & Acquisitions, Expansion Plans
    Table 25. Global Wafer Bump Packaging Market Size by Type (2017-2022) & (US$ Million)
    Table 26. Global Wafer Bump Packaging Revenue Market Share by Type (2017-2022)
    Table 27. Global Wafer Bump Packaging Forecasted Market Size by Type (2023-2028) & (US$ Million)
    Table 28. Global Wafer Bump Packaging Revenue Market Share by Type (2023-2028)
    Table 29. Global Wafer Bump Packaging Market Size by Application (2017-2022) & (US$ Million)
    Table 30. Global Wafer Bump Packaging Revenue Market Share by Application (2017-2022)
    Table 31. Global Wafer Bump Packaging Forecasted Market Size by Application (2023-2028) & (US$ Million)
    Table 32. Global Wafer Bump Packaging Revenue Market Share by Application (2023-2028)
    Table 33. North America Wafer Bump Packaging Market Size by Country (2017-2022) & (US$ Million)
    Table 34. North America Wafer Bump Packaging Market Size by Country (2023-2028) & (US$ Million)
    Table 35. Europe Wafer Bump Packaging Market Size by Country (2017-2022) & (US$ Million)
    Table 36. Europe Wafer Bump Packaging Market Size by Country (2023-2028) & (US$ Million)
    Table 37. Asia-Pacific Wafer Bump Packaging Market Size by Region (2017-2022) & (US$ Million)
    Table 38. Asia-Pacific Wafer Bump Packaging Market Size by Region (2023-2028) & (US$ Million)
    Table 39. Latin America Wafer Bump Packaging Market Size by Country (2017-2022) & (US$ Million)
    Table 40. Latin America Wafer Bump Packaging Market Size by Country (2023-2028) & (US$ Million)
    Table 41. Middle East & Africa Wafer Bump Packaging Market Size by Country (2017-2022) & (US$ Million)
    Table 42. Middle East & Africa Wafer Bump Packaging Market Size by Country (2023-2028) & (US$ Million)
    Table 43. ASE Technology Company Detail
    Table 44. ASE Technology Business Overview
    Table 45. ASE Technology Wafer Bump Packaging Product
    Table 46. ASE Technology Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 47. ASE Technology Recent Development
    Table 48. Amkor Technology Company Detail
    Table 49. Amkor Technology Business Overview
    Table 50. Amkor Technology Wafer Bump Packaging Product
    Table 51. Amkor Technology Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 52. Amkor Technology Recent Development
    Table 53. JCET Group Company Detail
    Table 54. JCET Group Business Overview
    Table 55. JCET Group Wafer Bump Packaging Product
    Table 56. JCET Group Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 57. JCET Group Recent Development
    Table 58. Powertech Technology Company Detail
    Table 59. Powertech Technology Business Overview
    Table 60. Powertech Technology Wafer Bump Packaging Product
    Table 61. Powertech Technology Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 62. Powertech Technology Recent Development
    Table 63. TongFu Microelectronics Company Detail
    Table 64. TongFu Microelectronics Business Overview
    Table 65. TongFu Microelectronics Wafer Bump Packaging Product
    Table 66. TongFu Microelectronics Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 67. TongFu Microelectronics Recent Development
    Table 68. Tianshui Huatian Technology Company Detail
    Table 69. Tianshui Huatian Technology Business Overview
    Table 70. Tianshui Huatian Technology Wafer Bump Packaging Product
    Table 71. Tianshui Huatian Technology Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 72. Tianshui Huatian Technology Recent Development
    Table 73. Chipbond Technology Company Detail
    Table 74. Chipbond Technology Business Overview
    Table 75. Chipbond Technology Wafer Bump Packaging Product
    Table 76. Chipbond Technology Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 77. Chipbond Technology Recent Development
    Table 78. ChipMOS Company Detail
    Table 79. ChipMOS Business Overview
    Table 80. ChipMOS Wafer Bump Packaging Product
    Table 81. ChipMOS Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 82. ChipMOS Recent Development
    Table 83. Hefei Chipmore Technology Company Detail
    Table 84. Hefei Chipmore Technology Business Overview
    Table 85. Hefei Chipmore Technology Wafer Bump Packaging Product
    Table 86. Hefei Chipmore Technology Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 87. Hefei Chipmore Technology Recent Development
    Table 88. Union Semiconductor (Hefei) Company Detail
    Table 89. Union Semiconductor (Hefei) Business Overview
    Table 90. Union Semiconductor (Hefei) Wafer Bump Packaging Product
    Table 91. Union Semiconductor (Hefei) Revenue in Wafer Bump Packaging Business (2017-2022) & (US$ Million)
    Table 92. Union Semiconductor (Hefei) Recent Development
    Table 93. Research Programs/Design for This Report
    Table 94. Key Data Information from Secondary Sources
    Table 95. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global Wafer Bump Packaging Market Share by Type: 2021 VS 2028
    Figure 2. Gold Bumping Features
    Figure 3. Solder Bumping Features
    Figure 4. Copper Pillar Alloy Features
    Figure 5. Other Features
    Figure 6. Global Wafer Bump Packaging Market Share by Application in 2021 & 2028
    Figure 7. Smartphone Case Studies
    Figure 8. LCD TV Case Studies
    Figure 9. Notebook Case Studies
    Figure 10. Tablet Case Studies
    Figure 11. Monitor Case Studies
    Figure 12. Other Case Studies
    Figure 13. Wafer Bump Packaging Report Years Considered
    Figure 14. Global Wafer Bump Packaging Market Size (US$ Million), Year-over-Year: 2017-2028
    Figure 15. Global Wafer Bump Packaging Market Size, (US$ Million), 2017 VS 2021 VS 2028
    Figure 16. Global Wafer Bump Packaging Market Share by Region: 2021 VS 2028
    Figure 17. Global Wafer Bump Packaging Market Share by Players in 2021
    Figure 18. Global Top Wafer Bump Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bump Packaging as of 2021)
    Figure 19. The Top 10 and 5 Players Market Share by Wafer Bump Packaging Revenue in 2021
    Figure 20. North America Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 21. North America Wafer Bump Packaging Market Share by Country (2017-2028)
    Figure 22. United States Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 23. Canada Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 24. Europe Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 25. Europe Wafer Bump Packaging Market Share by Country (2017-2028)
    Figure 26. Germany Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 27. France Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 28. U.K. Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 29. Italy Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 30. Russia Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 31. Nordic Countries Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 32. Asia-Pacific Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 33. Asia-Pacific Wafer Bump Packaging Market Share by Region (2017-2028)
    Figure 34. China Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 35. Japan Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 36. South Korea Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 37. Southeast Asia Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 38. India Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 39. Australia Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 40. Latin America Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 41. Latin America Wafer Bump Packaging Market Share by Country (2017-2028)
    Figure 42. Mexico Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 43. Brazil Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 44. Middle East & Africa Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 45. Middle East & Africa Wafer Bump Packaging Market Share by Country (2017-2028)
    Figure 46. Turkey Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 47. Saudi Arabia Wafer Bump Packaging Market Size YoY Growth (2017-2028) & (US$ Million)
    Figure 48. ASE Technology Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 49. Amkor Technology Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 50. JCET Group Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 51. Powertech Technology Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 52. TongFu Microelectronics Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 53. Tianshui Huatian Technology Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 54. Chipbond Technology Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 55. ChipMOS Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 56. Hefei Chipmore Technology Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 57. Union Semiconductor (Hefei) Revenue Growth Rate in Wafer Bump Packaging Business (2017-2022)
    Figure 58. Bottom-up and Top-down Approaches for This Report
    Figure 59. Data Triangulation
    Figure 60. Key Executives Interviewed
Please ask for List of Figures. Request Sample Report
Companies Included in Reports:
ASE Technology
Amkor Technology
JCET Group
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
Chipbond Technology
ChipMOS
Hefei Chipmore Technology
Union Semiconductor (Hefei)
Frequently Asked Questions
Wafer Bump Packaging report offers great insights of the market and consumer data and their interpretation through various figures and graphs. Report has embedded global market and regional market deep analysis through various research methodologies. The report also offers great competitor analysis of the industries and highlights the key aspect of their business like success stories, market development and growth rate.
Wafer Bump Packaging report is categorised based on following features:
  1. Global Market Players
  2. Geopolitical regions
  3. Consumer Insights
  4. Technological advancement
  5. Historic and Future Analysis of the Market
Wafer Bump Packaging report is designed on the six basic aspects of analysing the market, which covers the SWOT and SWAR analysis like strength, weakness, opportunity, threat, aspirations and results. This methodology helps investors to reach on to the desired and correct decision to put their capital into the market.

Related Reports

Ship Lights

The research report includes specific segments by region (country), by manufacturers, by Type and ... Read More